DAC8412FPCZ datasheet(7/20 Pages) AD

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Data Sheet

DAC8412/DAC8413

Rev. G | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

TA = +25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VSS to VDD

−0.3 V, +33.0 V

VSS to VLOGIC

−0.3 V, +33.0 V

VLOGIC to DGND

−0.3 V, +7.0 V

VSS to VREFL

−0.3 V, +VSS − 2.0 V

VREFH to VDD

+2.0 V, +33.0 V

VREFH to VREFL

+2.0 V, VSS − VDD

Current into Any VSS pin

±15 mA

Digital Input Voltage to DGND

−0.3 V, VLOGIC + 0.3 V

Digital Output Voltage to DGND

−0.3 V, +7.0 V

Operating Temperature Range

EP, FP, FPC

−40°C to +85°C

AT, BT, BTC

−55°C to +125°C

Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Power Dissipation Package

1000 mW

Lead Temperature

JEDEC Industry Standard

Soldering

J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case mounting conditions, that is, a

device in socket.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

28-Lead Plastic DIP (PDIP)

°C/W

28-Terminal Ceramic Leadless Chip Carrier (LLC)

°C/W

28-Lead Plastic Leaded Chip Carrier (PLLC)

°C/W

28-Lead Ceramic Dual In-Line Package (CERDIP)

°C/W

ESD CAUTION

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