SURFACE MOUNT DEVICE LED

Part No. : LT670WDT-CW1-R

REV: A / 0

4. Lead-Free Soldering

For Reflow Soldering :

1、Pre-Heat Temp: 150-180℃,120sec.Max.

2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.

3、Peak Temperature: 260℃，10sec.

4、Reflow Repetition: 2 Times

Max.

5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu

For Soldering Iron (Not Recommended) :

1、Iron Tip Temp: 350℃ Max.

2、Soldering Iron: 30w Max.

3、Soldering Time: 3 Sec. Max. One Time.

5. Drive Method

Circuit model A

Circuit model B

(A)Recommended circuit.

(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.

6. Reliability

1、Criteria For Judging The Damage

Criteria for Judgement

Item

Symbol

Test Conditions

MIN.

Max.

Forward Voltage

VF

IF=20mA

-

U.S.L.*)×1.1

Reverse Current

IR

VR=5V

-

U.S.L.*)×2.0

Luminous Intensity

IV

IF=20mA

L.S.L**)×0.7

-

*) U.S.L.: Upper Standard Level

**) L.S.L: Lower Standard Level

DRAWING NO. : DS-7A-11-0020

DATE : 2011-12-12

PAGE

14 of 16

PARA-FOR-068

Release

by

PARA LIGHT DCC