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STTH4R02UY Datasheet(PDF) 4 Page - STMicroelectronics

Part # STTH4R02UY
Description  Automotive ultrafast recovery diode
PDF  9 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STTH4R02UY Datasheet(HTML) 4 Page - STMicroelectronics

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Characteristics
STTH4R02-Y
4/9
Doc ID 17391 Rev 1
Figure 7.
Reverse recovery charges versus
dIF/dt (typical values)
Figure 8.
Reverse recovery time versus dIF/dt
(typical values)
0
20
40
60
80
100
120
0
50
100
150
200
250
300
350
400
450
500
Q
RR(nC)
I
F=4A
V
R=160V
T
j=125°C
T
j=25°C
dIF/dt(A/µs)
0
10
20
30
40
50
60
70
80
10
100
1000
t
RR(ns)
I
F=4A
V
R=160V
T
j=125°C
T
j=25°C
dIF/dt(A/µs)
Figure 9.
Peak reverse recovery current
versus dIF/dt (typical values)
Figure 10.
Dynamic parameters versus
junction temperature
0
2
4
6
8
10
0
50
100
150
200
250
300
350
400
450
500
I
RM(A)
I
F=4A
V
R=160V
T
j=125°C
T
j=25°C
dIF/dt(A/µs)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25
50
75
100
125
150
Q
RR;IRM [Tj]/ QRR;IRM [Tj=125°C]
I
RM
Q
RR
I
F=4A
V
R=160V
Tj(°C)
Figure 11.
Thermal resistance, junction to
ambient, versus copper surface
under tab - SMB
Figure 12.
Thermal resistance, junction to
ambient, versus copper surface
under tab - SMC
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a)(°C/W)
SMB
SCU(cm²)
Epoxy printed circuit board FR4,
copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a)(°C/W)
SMC
SCU(cm²)
Epoxy printed circuit board FR4,
copper thickness = 35 µm



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