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HCPL3000 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL3000 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
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3 / 9 page ![]() 1-331 Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Min. External Air Gap L(IO1) 6.0 mm Shortest distance measured through air, between (External Clearance) two conductive leads, input to output Min. External Tracking L(IO2) 6.0 mm Shortest distance path measured along outside surface Path (External Creepage) of optocoupler body between the input and output leads Min. Internal Plastic 0.15 mm Through insulation distance conductor to conductor Gap (Internal Clearance) inside the optocoupler cavity Recommended Protection for Output Transistors During switching transitions, the output transistors Q1 and Q2 of the HCPL-3000 can conduct large Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC 5.4 13 V Input Current (ON) I F(ON) 8* 20 mA Input Current (OFF) I F(OFF) - 0.2 mA Operating Temperature T A -20 80 °C *The initial switching threshold is 5 mA or less. amounts of current. Figure 1 describes a recommended circuit design showing current limiting resistors R1 and R2 which are necessary in order to prevent damage to the output transistors Q1 and Q2 (see Note 7). A bypass capacitor C1 is also recommended to reduce power supply noise. Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Conditions Fig. Note Storage Temperature T S -55 125 °C Operating Temperature T A -20 80 °C Input Continuous Current I F 25 mA 9 1 Reverse Voltage V R 6V T A = 25°C Supply Voltage V CC 18 V Output 1 Continuous Current I O1 0.5 A 10,11 1 Peak Current 1.0 A Pulse Width < 5 µs, 1 Duty cycle = 1% Voltage VO1 18 V Output 2 Continuous Current I O2 0.6 A 10,11,12 1 Peak Current 2.0 A Pulse Width < 5 µs, 12 1 Duty cycle = 1% Output Power Dissipation P O 500 mW 10 1 Total Power Dissipation P T 550 mW 11 1 Lead Solder Temperature 260 °C for 10 s, 1.0 mm below seating plane |
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