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HCPL3000 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard)

Part # HCPL3000
Description  Power Bipolar Transistor Base Drive Optocoupler
PDF  9 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL3000 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard)

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Insulation and Safety Related Specifications
Parameter
Symbol
Value Units
Conditions
Min. External Air Gap
L(IO1)
6.0
mm
Shortest distance measured through air, between
(External Clearance)
two conductive leads, input to output
Min. External Tracking
L(IO2)
6.0
mm
Shortest distance path measured along outside surface
Path (External Creepage)
of optocoupler body between the input and output leads
Min. Internal Plastic
0.15
mm
Through insulation distance conductor to conductor
Gap (Internal Clearance)
inside the optocoupler cavity
Recommended Protection
for Output Transistors
During switching transitions, the
output transistors Q1 and Q2 of
the HCPL-3000 can conduct large
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
V
CC
5.4
13
V
Input Current (ON)
I
F(ON)
8*
20
mA
Input Current (OFF)
I
F(OFF)
-
0.2
mA
Operating Temperature
T
A
-20
80
°C
*The initial switching threshold is 5 mA or less.
amounts of current. Figure 1
describes a recommended circuit
design showing current limiting
resistors R1 and R2 which are
necessary in order to prevent
damage to the output transistors
Q1 and Q2 (see Note 7). A bypass
capacitor C1 is also recommended
to reduce power supply noise.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Unit
Conditions
Fig.
Note
Storage Temperature
T
S
-55
125
°C
Operating Temperature
T
A
-20
80
°C
Input
Continuous Current
I
F
25
mA
9
1
Reverse Voltage
V
R
6V
T
A = 25°C
Supply Voltage
V
CC
18
V
Output 1
Continuous Current
I
O1
0.5
A
10,11
1
Peak Current
1.0
A
Pulse Width < 5
µs,
1
Duty cycle = 1%
Voltage
VO1
18
V
Output 2
Continuous Current
I
O2
0.6
A
10,11,12
1
Peak Current
2.0
A
Pulse Width < 5
µs,
12
1
Duty cycle = 1%
Output Power Dissipation
P
O
500
mW
10
1
Total Power Dissipation
P
T
550
mW
11
1
Lead Solder Temperature
260
°C for 10 s, 1.0 mm below seating plane



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