ICS650-01

System Peripheral Clock Source

MDS 650-01 C

3

Revision 092799

Printed 11/15/00

Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126• (408) 295-9800tel • (408) 295-9818fax

Parameter

Conditions

Minimum

Typical

Maximum

Units

ABSOLUTE MAXIMUM RATINGS (n

note 1)

Supply voltage, VDD

Referenced to GND

7

V

Inputs and Clock Outputs

Referenced to GND

-0.5

VDD+0.5

V

Ambient Operating Temperature

0

70

C

Soldering Temperature

Max of 10 seconds

260

C

Storage temperature

-65

150

C

DC CHARACTERISTICS (VDD = 3.3V

V or 5V unless noted))

Operating Voltage, VDD

3.0

5.5

V

Input High Voltage, VIH

Select inputs, OE

2

V

Input Low Voltage, VIL

Select inputs, OE

0.8

V

Output High Voltage, VOH

VDD=3.3V, IOH=-8mA

2.4

V

Output Low Voltage, VOL

VDD=3.3V, IOL=8mA

0.4

V

Output High Voltage, VOH, VDD = 3.3 or 5V

IOH=-8mA

VDD-0.4

V

Operating Supply Current, IDD, at 5V

No Load, note 2

50

mA

Operating Supply Current, IDD, at 3.3V

No Load, note 2

30

mA

Short Circuit Current, VDD = 3.3

Each output

±50

mA

Input Capacitance

Except X1

7

pF

AC CHARACTERISTICS (VDD = 3.3V

V or 5V unless noted)

Input Crystal or Clock Frequency

14.31818

MHz

Output Clocks Accuracy (synthesis error)

All clocks

1

ppm

Output Clock Rise Time

0.8 to 2.0V

1.5

ns

Output Clock Fall Time

2.0 to 0.8V

1.5

ns

Output Clock Duty Cycle

At VDD/2

40

50

60

%

One Sigma Jitter, except ACLK

75

ps

One Sigma Jitter, ACLK

170

ps

Absolute Clock Period Jitter PCLK, UCLK, 20M

- 500

500

ps

Electrical Specifications

Notes:

1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged

exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.

2. With all clocks at highest frequencies.

External Components

The ICS650 requires a minimum number of external components for proper operation. Decoupling

capacitors of 0.1µF should be connected between VDD and GND (on pins 4 and 6, and pins 16 and 14),

as close to the chip as possible. A series termination resistor of 33

Ω may be used for each clock output. The

14.31818 MHz crystal must be connected as close to the chip as possible. The crystal should be a

fundamental mode, parallel resonant, 30ppm or better (to meet the Ethernet specs). Crystal capacitors

should be connected from pins X1 to ground and X2 to ground. The value of these capacitors is given by

crystal with 16pF load capacitance, two 8pF caps should be used. If a clock input is used, drive it into X1

and leave X2 unconnected.