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HCTS02MS Datasheet(PDF) 8 Page - Intersil Corporation |
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HCTS02MS Datasheet(HTML) 8 Page - Intersil Corporation |
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8 / 11 page ![]() 8 HCTS02MS Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20mm x 2.24mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS02MS Y1 VCC Y4 A1 (2) B1 (3) Y2 (4) A2 (5) (12) B4 (11) A4 (10) Y3 (9) B3 (6) (7) (8) (1) (14) (13) B2 GND A3 Spec Number 518841 |
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