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HUF76013P3 Datasheet(PDF) 1 Page - Intersil Corporation

Part # HUF76013P3
Description  20A, 20V, 0.022 Ohm, N-Channel, Logic Level Power MOSFETs
PDF  11 Pages
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HUF76013P3 Datasheet(HTML) 1 Page - Intersil Corporation

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1
TM
File Number
4849
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil and Design is a trademark of Intersil Corporation. | Copyright
© Intersil Corporation 2000
UltraFET® is a registered trademark of Intersil Corporation.
HUF76013P3, HUF76013D3S
20A, 20V, 0.022 Ohm, N-Channel, Logic
Level Power MOSFETs
The HUF76013 is an application-specific MOSFET
optimized for switching when used as the upper switch in
synchronous buck applications. The low gate charge and low
input capacitance results in lower driver and lower switching
losses thereby increasing the overall system efficiency.
Symbol
Packaging
Features
• 20A, 20V
-rDS(ON) = 0.022Ω, VGS = 10V
-rDS(ON) = 0.030Ω, VGS = 5V
• PWM Optimized for Synchronous Buck Applications
• Fast Switching
• Low Gate Charge
-Qg Total 14nC (Typ)
• Low Capacitance
-CISS 624pF (Typ)
-CRSS 71pF (Typ)
HUF76013D3S
JEDEC TO-252AA
HUF76013P3
JEDEC TO-220AB
D
G
S
GATE
SOURCE
DRAIN (FLANGE)
DRAIN
(FLANGE)
DRAIN
SOURCE
GATE
Ordering Information
PART NUMBER
PACKAGE
BRAND
HUF76013P3
TO-220AB
76013P
HUF76013D3S
TO-252AA
76013D
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the HUF76013D3S in tape and reel, e.g., HUF76013D3ST.
Absolute Maximum Ratings
TC = 25
oC, Unless Otherwise Specified
SYMBOL
PARAMETER
HUF76013P3,
HUF76013D3S
UNITS
VDSS
Drain to Source Voltage (Note 1)
20
V
VDGR
Drain to Gate Voltage (RGS = 20kΩ) (Note 1)
20
V
VGS
Gate to Source Voltage
±16
V
ID
ID
IDM
Drain Current
Continuous (TC = 25
oC, V
GS = 10V) (Figure 2)
Continuous (TC = 100
oC, V
GS = 5V)
Pulsed Drain Current
20
20
Figure 4
A
A
A
PD
Power Dissipation
Derate Above 25oC
50
0.4
W
W/oC
TJ, TSTG
Operating and Storage Temperature
-55 to 150
oC
TL
Tpkg
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
300
260
oC
oC
THERMAL SPECIFICATIONS
RθJC
Thermal Resistance Junction to Case, TO-220, TO-252
2.5
oC/W
RθJA
Thermal Resistance Junction to Ambient TO-220
62
oC/W
Thermal Resistance Junction to Ambient TO-252
100
oC/W
NOTE:
1. TJ = 25
oC to 125oC.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Data Sheet
April 2000


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