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AN2785 Datasheet(PDF) 49 Page - STMicroelectronics

Part # AN2785
Description  L6393 half bridge gate driver
PDF  51 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN2785 Datasheet(HTML) 49 Page - STMicroelectronics

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The group of LP1, LP2 and LP3 parasitic inductances is located along the low-side path of
each half-bridge, between the OUT pin and the GND of the related driver, and provides an
undesired contribution to the issue of below-ground voltage spikes on each OUT pin of the
L6393 (described in Section 9.1). In fact, at the beginning of the current recirculation on the
low-side switches, the current may experience a high dI/dt which is able to produce, on
those parasitic inductances, significant voltage spikes. Those spikes add up with the voltage
drop of the low-side diode and of the RSENSE (when present) and have a negative sign, so
the overall voltage drop between OUT and GND may be significant. The suggestion is to
limit as much as possible each contribution to this phenomenon by limiting the length of
tracks LP1, LP2 and LP3 and by using an RSENSE resistor with low intrinsic inductance. LP1
may be reduced by connecting the OUT line directly to the collector (or drain) of the low-side
IGBT (or MOSFET), LP2 may be reduced by placing the RSENSE resistor as close as
possible to the emitter (or source) of the low-side IGBT (or MOSFET). The LP3 may be
minimized by connecting the GND line (also called driver ground) of the related gate driver
directly to the RSENSE resistor.
LP4 represents the parasitic inductance located between the ground connections of each
gate driver (driver ground) and the ground connection of the application controller (also
called signal ground). Due to its location, this parasitic inductance introduces noise which is
experienced by the input logic signals and by the L6393 comparator output signal. In fact,
each phase of the bridge causes high currents (with high dI/dt) to flow on these paths,
causing voltage noise which drops between the gate driver ground and the controller
ground. This noise between the two grounds is directly added to all logic and analog voltage
signals between the gate driver and the micro-controller, including the input logic signals
and the analog output of the related comparator. It is recommended to minimize this noise
by reducing as much as possible the distance between the signal ground and the driver
ground (for each gate driver in the system). In general, it is recommended to connect the
signal ground to the various driver grounds through a star connection, in order to improve
the balancing and symmetry for any kind of driving topology.
Note:
Ground loops must be avoided; only a single path must connect two different ground nodes.
The LP5 parasitic inductance is not usually critical because it stands between the minus
terminal of the bulk capacitor and the signal/power ground: the spikes on this parasitic
element have little influence on other system nodes.
Another useful suggestion is to respect some distance between the lines that switch with
high-voltage transitions and the signal lines sensitive to electrical noise. The tracks of each
OUT phase bringing significant currents and high voltages should be separated from the
logic lines and analog sensing circuits of the comparators.



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