DocID024463 Rev 2

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TN0991

Packing specifications and labelling description

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Figure 5. Typical tape dimensions for WLCSP packages in 12 mm carrier tape

1. A1 bump location varies with the device layout.

2. The dimensions shown in the above figure are for illustrative purpose. Actual carrier tape dimensions may

slightly differ.

The cavities in the carrier tape have been designed to avoid damaging the components. No

hole is present in the cavity to avoid any impact or any external contamination of the solder

bumps. Refer to Table 2 for the cavity dimension according to the die size.

electrostatic discharge and ensures the total discharge of the component prior to the

placement on the PCB. Conductivity is guaranteed to be constant and is not affected by

4.00± 0.10

4.00± 0.10

2.00 ± 0.05

1.50 ± 0.10

1.75 ± 0.10

5.50 ± 0.05

12.00 + 0.30

- 0.10

1.00 ± 0.05

0.19

R 0.40

1.02

5°

5° MAX

5° MAX

2.19 ± 0.05

0.68 ± 0.05

5° MAX

0.28 ± 0.02

3.74 ± 0.05