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PUSB3AB6 Datasheet(PDF) 6 Page - NXP Semiconductors

Part # PUSB3AB6
Description  ESD protection for ultra high-speed interfaces
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PUSB3AB6 Datasheet(HTML) 6 Page - NXP Semiconductors

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PUSB3AB6
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 3 March 2015
6 of 12
NXP Semiconductors
PUSB3AB6
ESD protection for ultra high-speed interfaces
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snapback behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snapback state after exceeding
breakdown voltage (due to an ESD pulse for instance).
tp = 100 ns; Transmission Line Pulse (TLP)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 6.
Dynamic resistance with positive clamping;
typical values
Fig 7.
Dynamic resistance with negative clamping;
typical values
tp = 5 ns; Very-Fast Transmission-Line Pulse (VF-TLP)
tp = 5 ns; Very-Fast Transmission-Line Pulse (VF-TLP)
Fig 8.
Dynamic resistance with positive clamping;
typical values
Fig 9.
Dynamic resistance with negative clamping;
typical values
VCL (V)
025
20
10
15
5
aaa-016902
10
15
5
20
25
IPP
(A)
0
VCL (V)
-25
0
-5
-15
-10
-20
aaa-016903
-15
-10
-20
-5
0
IPP
(A)
-25
VCL (V)
025
20
10
15
5
aaa-016904
10
15
5
20
25
IPP
(A)
0
VCL (V)
-25
0
-5
-15
-10
-20
aaa-016905
-15
-10
-20
-5
0
IPP
(A)
-25



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