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LM27341 Datasheet(PDF) 22 Page - Texas Instruments |
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LM27341 Datasheet(HTML) 22 Page - Texas Instruments |
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22 / 44 page ![]() RTJC = TJ - TC Power LM27341, LM27342, LM27341-Q1, LM27342-Q1 SNVS497E – NOVEMBER 2008 – REVISED APRIL 2013 www.ti.com RθJA values for the MSOP-PowerPad @ 1Watt dissipation: Number of Board Size of Bottom Layer Copper Size of Top Layer Copper Number of 10 mil RθJA Layers Connected to DAP Connected to Dap Thermal Vias 2 0.25 in2 0.05 in2 8 80.6 °C/W 2 0.5625 in2 0.05 in2 8 70.9 °C/W 2 1 in2 0.05 in2 8 62.1 °C/W 2 1.3225 in2 0.05 in2 8 54.6 °C/W 4 (Eval Board) 3.25 in2 2.25 in2 14 35.3 °C/W RθJA values for the SON @ 1Watt dissipation: Number of Board Size of Bottom Layer Copper Size of Top Layer Copper Number of 8 mil RθJA Layers Connected to DAP Connected to Dap Thermal Vias 2 0.25 in2 0.05 in2 8 78 °C/W 2 0.5625 in2 0.05 in2 8 65.6 °C/W 2 1 in2 0.05 in2 8 58.6 °C/W 2 1.3225 in2 0.05 in2 8 50 °C/W 4 (Eval Board) 3.25 in2 2.25 in2 15 30.7 °C/W Figure 38. Estimate of Thermal Resistance vs. Ground Copper Area Eight Thermal Vias and Natural Convection Method 2: The second method requires the user to know the thermal impedance of the silicon junction to case. (RθJC) is approximately 9.5°C/W for the MSOP-PowerPad package or 9.1°C/W for the SON. The case temperature should be measured on the bottom of the PCB at a thermal via directly under the DAP of the LM27341/LM27342. The solder resist should be removed from this area for temperature testing. The reading will be more accurate if it is taken midway between pins 2 and 9, where the NMOS switch is located. Knowing the internal dissipation from the efficiency calculation given previously, and the case temperature (TC) we have: (50) Therefore: TJ = (RθJC x PLOSS) + TC (51) 22 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: LM27341 LM27342 LM27341-Q1 LM27342-Q1 |
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