LX1431

PRODUCT DA T ABOOK 1996/1997

Copyright © 1997

Rev. 1.2

4/97

2

ABSOLUTE MAXIMUM RATINGS

(Note 1)

V

GND-F to GND-S ........................................................................................................ 0.7V

Operating Junction Temperature

Plastic (M, DM Packages) ..................................................................................... 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature ..................................................................................................... 300°C

PACKAGE PIN OUTS

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal.

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

Junction Temperature Calculation:

T

The

θ

JA

numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow.

THERMAL DATA

M PACKAGE

(Top View)

BLOCK DIAGRAM

gm=

60µA/V

REF

R

MID

R

TOP

COMP

COLLECTOR

GND-SENSE

GND-FORCE

6

5

8

7

43

2

1

5K

5K

2.5V

DM PACKAGE

(Top View)

REF

R

MID

GND-F

GND-S

COLLECTOR

COMP

R

TOP

1

8

2

7

3

6

4

5

1

8

2

7

3

6

4

5

REF

R

MID

GND-F

GND-S

COLLECTOR

COMP

R

TOP