LX6431BCLP datasheet(2/11 Pages) MICROSEMI

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P RECISION P ROGRAMMABLE R EFERENCE S

LX6431/LX6431A/LX6431B

PRODUCT DA T ABOOK 1996/1997

Rev. 1.4

6/99

P RODUCTION D AT A S HEET

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Cathode to Anode Voltage (V

KA) ................................................................... -0.3V to 37V

Reference Input Current (I

REF) .................................................................... -50µA to 10µA

Continuous Cathode Current (I

K) ......................................................... -100mA to 150mA

Operating Junction Temperature

Plastic (DM & LP Packages) ................................................................................. 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature ..................................................................................................... 300°C

PACKAGE PIN OUTS

CATHODE

N.C.

ANODE

N.C.

REF

ANODE

N.C.

DM PACKAGE

(Top View)

LP PACKAGE

(Top View)

1. CATHODE

2. ANODE

3. REF

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal. Pin

numbers refer to DIL packages only.

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

165°C/W

LP PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

156°C/W

Junction Temperature Calculation:

J = TA + (PD x θJA).

The

JA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

THERMAL DATA

BLOCK DIAGRAM

Cathode (K)

Anode (A)

REF

Ref (R)

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