MSCO264A 02-11-00

DSW UPT5 <-> (36256)

UPT5-UPT48

UPTB5-UPTB48

Features

Features

• Powermite Package, 5 to 48 V

• Peak Pulse Power 1000 W for 8x20 Micro-second Pulse

• Clamping Time in Pico-seconds

• Integral Heat Sink / Locking Tabs

• Full Metallic Bottom Eliminates Flux Entrapment

• Bi-directional Version Available

Description

Absolute Maximum Ratings at 25

°C

Stand-Off Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 to 48 VOLTS ( See Characteristics Table )

Peak Pulse Power ( 8 x 20 micro-second pulse ) . . . . . . . . . . . . . . . . 1000 WATTS . . ( See Figure 1 )

Peak Pulse Power ( 1 milli-second pulse ) . . . . . . . . . . . . . . . . . . . . . 150 WATTS . . ( See Figure 2 )

Peak Pulse Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Characteristics Table

Breakdown Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Characteristics Table

Power( Continuous ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 WATTS

Electrical Characteristics at 25

°C

DEVICE

TYPE

Stand-Off

Voltage

Minimum

Breakdown

Voltage

BV(min) @ 1 mA

Maximum

Leakage

Current

Maximum

Peak

Current*

Maximum

Clamping

Voltage

Maximum

Temp.

Coefficient

of BV

Unidirectional

Bi-directional

(V)

(V)

(

µµA)

(A)

(V)

(%/

°°C)

UPT 5

UPTB 5

5

6.0

50

89.4

9.5

.030

UPT 8

UPTB 8

8

9.0

2

62.1

13.7

.040

UPT10

UPTB10

10

11.0

2

47.2

18.0

.045

UPT12

UPTB12

12

13.8

1

40.3

21.6

.050

UPT15

UPTB15

15

16.7

1

33.9

26.0

.055

UPT17

UPTB17

17

19.0

1

30.8

29.2

.060

UPT24

UPTB24

24

28.4

1

22.0

43.2

.070

UPT28

UPTB28

28

31.0

1

19.2

47.8

.075

UPT33

UPTB33

33

36.8

1

16.4

56.7

.080

UPT48

UPTB48

48

54.0

1

11.2

84.3

.090

* See Figure 1

580 Pleasant St.

Watertown, MA 02472

PH: (617) 926-0404

FAX: (617) 924-1235

SURFACE MOUNT

TRANSIENT VOLTAGE

SUPPRESSORS

Microsemi’s new Powermite UPT series transient voltage suppressors feature oxide passivated zener type

chips, with high-temperature solder bonds to achieve high surge capability, and negligible electrical degrad-

ation under repeated surge conditions.

In addition to its size advantages, Powermite package includes a full metallic bottom which eliminates the

possibility of solder flux entrapment at assembly, and a unique locking tab that acts as an integral heatsink.

Innovative design makes this device fully compatible for use with automatic insertion equipment.