LMV331IDBVR datasheet(4/39 Pages) TI1

4 / 39 page

LMV331, LMV393, LMV339

SLCS136T – AUGUST 1999 – REVISED JANUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage(2)

5.5

VID

Differential input voltage(3)

±5.5

Input voltage range (either input)

VCC+

At or below TA = 25°C,

Duration of output short circuit (one amplifier) to ground(4)

Unlimited

VCC ≤ 5.5 V

Operating virtual junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.

(3)

Differential voltages are at IN+ with respect to IN–.

(4)

Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1000

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage (single-supply operation)

2.7

5.5

VOUT

Output voltage

VCC+ + 0.3

Operating free-air temperature

–40

125

°C

7.4 Thermal Information

LMV339

LMV393

LMV331

THERMAL METRIC(1)

RUC

DDU

DGK

DBV

DCK

UNIT

14 PINS

8 PINS

5 PINS

RθJA

Junction-to-ambient

113

216

210

172

149

206

252

thermal resistance

RθJC(top) Junction-to-case (top)

—

51.3

—

thermal resistance

RθJB

Junction-to-board

—

59.0

—

thermal resistance

°C/W

ψJT

Junction-to-top

characterization

—

1.2

—

parameter

ψJB

Junction-to-board

characterization

—

59.0

—

parameter

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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