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Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

SPST Reflective AlGaAs PIN Diode Switch

RoHS Compliant

M/A-COM Products

Rev. V3

MA4AGSW1

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

ASSEMBLY INSTRUCTIONS

CLEANLINESS

These chips should be handled in a clean environment.

STATIC SENSITIVITY

These Devices are considered ESD Class 0 HBM. Proper ESD techniques should be used when handling

these devices.

GENERAL HANDLING

The protective polymer coating on the active areas of the die provides scratch and impact protection,

particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with

vacuum pickups, or alternatively with plastic tweezers.

ASSEMBLY TECHNIQUES

The MA4AGSW1, AlGaAs switch is designed to be mounted with electrically conductive silver epoxy or with a

low temperature solder, which does not have a rich tin content. All die attach and wire bonding methods

should be compatible with gold metal.

SOLDER DIE ATTACH

Solder which does not scavenge gold, such as 80/20, Au/Sn or Indalloy #2 is recommended. Do not expose

die to temperatures greater than 300°C for more than 10 seconds.

ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH

Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal

resistance. Cure epoxy per manufacturer

RIBBON/WIRE BONDING

Thermo compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.

A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the

lowest inductance and best microwave performance.

Ordering Information

Part Number

Package

MA4AGSW1

Waffle Pack