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GS3MBF Datasheet(PDF) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd

Part # GS3MBF
Description  SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
PDF  2 Pages
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Manufacturer  CHENDA [Microdiode Semiconductor (Shenzhen) Co., Ltd]
Direct Link  http://www.microdiode.com/en
Logo CHENDA - Microdiode Semiconductor (Shenzhen) Co., Ltd

GS3MBF Datasheet(HTML) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd

  GS3MBF Datasheet HTML 1Page - Microdiode Semiconductor (Shenzhen) Co., Ltd GS3MBF Datasheet HTML 2Page - Microdiode Semiconductor (Shenzhen) Co., Ltd  
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GS3ABF
GS3KBF
GS3DBF
S3DB
GS3JBF
GS3GBF
GS3ABF THRU GS3MBF
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 3.0 Amperes
Note: 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.5x0.5
”(12.7x12.7mm) copper pad areas
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
VOLTS
VOLTS
VOLTS
SYMBOLS
UNITS
Amps
Amps
Volts
VRRM
VRMS
VDC
I(AV)
IFSM
VF
3.0
100
1.1
Operating junction and storage temperature range
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=65 C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0A
Maximum DC reverse current
TA=25 C
at rated DC blocking voltage
TA=125 C
IR
5.0
200.0
R
θJA
CJ
TJ,TSTG
40
45
-55 to +150
pF
C
A
µ
Typical thermal resistance (NOTE 2)
C/W
Typical junction capacitance (NOTE 1)
GS3BBF
GS3MBF
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
MDD Catalog Number
Dimensions in inches and (millimeters)
SMBF
Cathode Band
Top View
0.165(4.2)
0.173(4.4)
0.216(5.5)
0.200(5.1)
0.146(3.70)
0.138(3.50)
0.075(1.90)
0.086(2.20)
0.051(1.30)
0.043(1.10)
0.010(0.26)
0.0071(0.18)
0.051(1.30)
0.039(1.0)
FEATURES
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
Lead free in comply with EU RoHS 2011/65/EU diretives
Easy to pick and place
MECHANICAL DATA
Case: JEDEC SMBF molded plastic body
Terminals: leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight:57mg/0.002oz
Marking code
S3AB
S3BB
S3GB
S3JB
S3KB
S3MB


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