For the PLCC packaged DP8392 it is recommended that a

5 – 11 and a second one be connected to pins 20 – 25 To

reduce the thermal resistance to the required value the

for high transmit duty cycle applications

Figure 7 illustrates

a recommended component side layout for these planes

TLF11085 – 14

Layout as viewed from component side

FIGURE 6 Typical Layout Considerations

for DP8392CN

(Not to Scale)

TLF11085 – 15

FIGURE 7 Recommended Layout and Dissipation Planes for DP8392CV (Not to Scale)

6