LM2941CSSLASHNOPB datasheet(5/30 Pages) TI1

5 / 30 page

LM2941, LM2941C

www.ti.com

SNVS770I – JUNE 1999 – REVISED JANUARY 2015

6.4 Thermal Information

LM2941LD

LM2941S, LM2941T

WSON

TO-263

TO-220

THERMAL METRIC(1)(2)

UNIT

(NGN)

(KTT)

(KC)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

40.5

32.1

RθJC(top)

Junction-to-case (top) thermal resistance

26.2

43.2

25.6

RθJB

Junction-to-board thermal resistance

22.9

18.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

11.4

8.5

ψJB

Junction-to-board characterization parameter

17.2

21.9

17.7

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

0.9

0.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will

go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper

area thermally connected to the package. The value RθJA for the WSON package is specifically dependent on PCB trace area, trace

material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,

refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal

performance.

6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD

5 V

≤ VOUT ≤ 20 V, VIN = VOUT + 5 V, COUT = 22 μF, unless otherwise specified. MIN (minimum) and MAX (maximum)

specifications in apply over the full Operating Temperature Range (unless otherwise specified) and typical values apply at TJ

= 25°C.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

5 mA

≤ IOUT ≤ 1 A

(1)

1.211

1.275

1.339

Reference voltage

5 mA

≤ IOUT ≤ 1 A

(1), T

J = 25°C

1.237

1.275

1.313

Line regulation

VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA

mV/V

Load regulation

50 mA

≤ IOUT ≤ 1 A

mV/V

Output impedance

100 mADC and 20 mArms, ƒOUT = 120 Hz

Ω/V

VOUT + 2 V ≤ VIN < 26 V, IOUT = 5 mA

VOUT + 2 V ≤ VIN < 26 V, IOUT = 5 mA, TJ =

25°C

Quiescent current

VIN = VOUT + 5 V, IOUT = 1 A

VIN = VOUT + 5 V, IOUT = 1 A, TJ = 25°C

RMS output noise, % of VOUT

10 Hz to 100 kHz, IOUT = 5 mA

0.003%

ƒOUT = 120 Hz, 1 Vrms, IL = 100 mA

0.005

0.04

Ripple rejection

%/V

ƒOUT = 120 Hz, 1 Vrms, IL = 100 mA, TJ = 25°C

0.005

0.02

Long-term stability

0.4

%/1000 Hr

IOUT = 1 A

0.5

Dropout voltage

IOUT = 1 A, TJ = 25°C

0.5

0.8

IOUT = 100 mA

110

200

Short-circuit current

VIN max = 26 V

(2)

1.6

1.9

VOUT max 1 V above nominal VOUT

Maximum line transient

ROUT = 100 Ω, t ≤ 100 ms

Maximum operational input

VDC

voltage

Reverse polarity

ROUT = 100 Ω, VOUT ≥ −0.6 V

−15

−30

DC input voltage

Reverse polarity

≤ 100 ms, ROUT = 100 Ω

−50

−75

transient input voltage

(1)

The output voltage range is 5 V to 20 V and is determined by the two external resistors, R1 and R2. See Figure 18.

(2)

Output current capability will decrease with increasing temperature, but will not go below 1 A at the maximum specified temperatures.

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