 2015 Microchip Technology Inc.

DS20005455A-page 13

HV582

Microchip Technology Drawing C04-377-J Rev C Sheet 2 of 2

Number of Terminals

Overall Height

Ball Diameter

Overall Width

Mold Cap Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

A2

e

E

N

0.75 BSC

0.35

-

0.21

0.40

-

0.32

10.00

MILLIMETERS

MIN

NOM

169

0.45

1.10

-

MAX

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Terminal A1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

D

10.00

0.50

0.45

0.50

(Complies with JEDEC Terminal Assignment recommendations)