MRF24WN0MB datasheet(10/36 Pages) MICROCHIP

10 / 36 page

MRF24WN0MA/MB

DS50002410A-page 10

Advance Information

 2015 Microchip Technology Inc.

FIGURE 1-7:

MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT

1.3

Soldering Recommendations

The MRF24WN0MA/MB wireless module was assem-

bled using the IPC/JEDEC J-STD-020 Standard lead-

free reflow profile. The MRF24WN0MA/MB module

can be soldered to the host PCB using standard leaded

and lead-free solder reflow profiles.

To avoid damaging the module, adhere to the following

recommendations:

• Solder reflow recommendations are provided in

the Microchip Application Note, AN233 "Solder

Reflow Recommendation" (DS00233)

• Do not exceed a peak temperature (TP) of 250°C

• Refer to the solder paste data sheet for specific

reflow profile recommendations from the vendor

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

Best

Okay

No Copper

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MRF24WN0MB Datasheet(PDF) 10 Page - Microchip Technology