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MB05F Datasheet(PDF) 2 Page - Sangdest Microelectronic (Nanjing) Co., Ltd

Part # MB05F
Description  Designed for surface mount application
PDF  4 Pages
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Manufacturer  SMC [Sangdest Microelectronic (Nanjing) Co., Ltd]
Direct Link  http://www.smc-diodes.com/
Logo SMC - Sangdest Microelectronic (Nanjing) Co., Ltd

MB05F Datasheet(HTML) 2 Page - Sangdest Microelectronic (Nanjing) Co., Ltd

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Technical Data
Green Products
Data Sheet N1456, Rev. A
• China - Germany - Korea - Singapore - United States •
• http://www.smc-diodes.com - sales@ smc-diodes.com •
MB05F THRU MB10F
Marking Diagram:
Where XXXXX is YYWWL
MB05F
= Part Name
YY
= Year
WW
= Week
L
= Lot Number
Cautions：Molding resin
Epoxy resin UL:94V-0
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Characteristic
Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F
Unit
Device
Marking
Marking MB05F MB1F MB2F MB4F MB6F MB8F MB10F
-
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
480
700
V
Average Rectified Output Current
(Note1)@TA=40℃
(Note 2)@TA=40℃
IO
0.5
0.8
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
30
A
Forward Voltage per element
@IF =0.8A
VFM
1.1
V
Peak Reverse Current
@TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C
IR
5
500
μA
Typical Junction Capacitance (Note 3)
Cj
13
pF
Typical Thermal Resistance per leg
RθJA
60
°C/W
RθJL
16
Operating Junction and Storage
Temperature
Range
TJ ,TSTG
-55+150
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm
2 solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm
2 solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.



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