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USB3250 Datasheet(PDF) 13 Page - Microchip Technology |
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USB3250 Datasheet(HTML) 13 Page - Microchip Technology |
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13 / 46 page ![]() 2013 - 2016 Microchip Technology Inc. DS00002142A-page 13 USB3250 LEAKAGE CURRENT OFF-State Leakage Current ILZ ± 1 uA PORT CAPACITANCE Transceiver Input Capacitance CIN Pin to GND 5 10 pF TABLE 6-4: DYNAMIC CHARACTERISTICS: ANALOG I/O PINS (DP/DM) Parameter Symbol Conditions MIN TYP MAX Units FS OUTPUT DRIVER TIMING Rise Time TFSR CL = 50pF; 10 to 90% of |VOH - VOL| 420 ns Fall Time TFFF CL = 50pF; 10 to 90% of |VOH - VOL| 420 ns Output Signal Crossover Voltage VCRS Excluding the first transition from IDLE state 1.3 2.0 V Differential Rise/Fall Time Matching FRFM Excluding the first transition from IDLE state 90 111.1 % HS OUTPUT DRIVER TIMING Differential Rise Time THSR 500 ps Differential Fall Time THSF 500 ps Driver Waveform Requirements Eye pattern of Template 1 in USB 2.0 specification See Figure 6 -2 HIGH SPEED MODE TIMING Receiver Waveform Requirements Eye pattern of Template 4 in USB 2.0 specification See Figure 6 -2 Data Source Jitter and Receiver Jitter Tolerance Eye pattern of Template 4 in USB 2.0 specification See Figure 6 -2 (VDD1.8 =1.6 to 2.0V; VDD3.3 =3.0 to 3.6V; VSS = 0V; TA = -40 oC to +85oC; unless otherwise specified.) TABLE 6-5: DYNAMIC CHARACTERISTICS: DIGITAL UTMI PINS Parameter Symbol Conditions MIN TYP MAX Units UTMI TIMING RXDATA[7:0] TPD Propagation delay from CLKOUT to signal CL = 10pF 24 ns RXVALID 24 RXACTIVE 24 RXERROR 24 LINESTATE[1:0] 24 TXREADY 24 (VDD1.8 =1.6 to 2.0V; VDD3.3 =3.0 to 3.6V; VSS = 0V; TA = -40 oC to +85oC; unless otherwise specified.) TABLE 6-3: DC ELECTRICAL CHARACTERISTICS: ANALOG I/O PINS (DP/DM) (CONTINUED) Parameter Symbol Conditions MIN TYP MAX Units (VDD1.8 =1.6 to 2.0V; VDD3.3 =3.0 to 3.6V; VSS = 0V; TA = -40 oC to +85oC; unless otherwise specified.) |
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