LM6321 datasheet(4/10 Pages) NSC

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AC Electrical Characteristics

The following specifications apply for Supply Voltage = ±15V, V

CM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted.

Boldface limits apply for T

A = TJ = TMIN to TMAX; all other limits TA = TJ = 25˚C.

Symbol

Parameter

Conditions

Typ

LM6121

LM6221

LM6321

Units

Limit

(Note 5)

Slew Rate 1

IN = ±11V, RL = 1kΩ

1200

550

V/µs

Min

Slew Rate 2

IN = ±11V, RL = 50Ω

800

550

(Note 7)

Slew Rate 3

IN = 2VPP,RL = 50Ω

550

+ = 5V (Note 6)

−3 dB Bandwidth

IN = ±100 mVPP,RL = 50Ω

MHz

L ≤ 10 pF

Min

r,tf

Rise Time

L = 50Ω,CL ≤ 10 pF

7.0

Fall Time

O = 100 mVPP

Propagation

L = 50Ω,CL ≤ 10 pF

4.0

Delay Time

O = 100 mVPP

Overshoot

L = 50Ω,CL ≤ 10 pF

O = 100 mVPP

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating

the device beyond its rated operating conditions.

Note 2: During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to output differential voltages

in excess of 8V the input current should be limited to ±20 mA.

Note 3: The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions.

Note 4: The thermal resistance

θJA of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1,

4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistance

θJA of the N package is 84˚C/W. The thermal re-

sistance

θJA of the device in the M package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14) are

connected to 1 square inch of 2 oz. copper.

Note 5: Limits are guaranteed by testing or correlation.

Note 6: The input is biased to 2.5V and VIN swings Vpp about this value. The input swing is 2 Vpp at all temperatures except for the AV 3 test at −55˚C where it is

reduced to 1.5 Vpp.

Note 7: Slew rate is measured with a ±11V input pulse and 50

Ω source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50Ω load, the output swing

will be approximately ±10V. Slew rate is calculated for transitions between ±5V levels on both rising and falling edges. A high speed measurement is done to minimize

device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to ±10V for measurements

at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs.

Note 8: The test circuit consists of the human body model of 120 pF in series with 1500

Ω.

Note 9: For specification limits over the full Military Temperature Range, see RETS6121X.

Note 10: The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =

(TJ(max)–TA)/θJA.

Typical Performance Characteristics T

J = 25˚C, unless otherwise specified

Frequency Response

DS009223-11

Frequency Response

DS009223-12

Slew Rate vs Temperature

DS009223-13

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