(V

Timing Interval

T#

Tested Limits

Units

Min

Max

STATUS BYTE READ TIMING (See

Figure 4)

Chip-Select Setup/Hold Time

T7

0

ns

Port-Select Setup Time

T8

30

ns

Port-Select Hold Time

T9

30

ns

Read Data Access Time

T10

180

ns

Read Data Hold Time

T11

0

ns

RD High to Hi-Z Time

T12

180

ns

COMMAND BYTE WRITE TIMING (See

Figure 5)

Chip-Select Setup/Hold Time

T7

0

ns

Port-Select Setup Time

T8

30

ns

Port-Select Hold Time

T9

30

ns

Busy Bit Delay

T13

(Note 3)

ns

WR Pulse Width

T14

100

ns

Write Data Setup Time

T15

50

ns

Write Data Hold Time

T16

120

ns

DATA WORD READ TIMING (See

Figure 6)

Chip-Select Setup/Hold Time

T7

0

ns

Port-Select Setup Time

T8

30

ns

Port-Select Hold Time

T9

30

ns

Read Data Access Time

T10

180

ns

Read Data Hold Time

T11

0

ns

RD High to Hi-Z Time

T12

180

ns

Busy Bit Delay

T13

(Note 3)

ns

Read Recovery Time

T17

120

ns

DATA WORD WRITE TIMING (See

Figure 7)

Chip-Select Setup/Hold Time

T7

0

ns

Port-Select Setup Time

T8

30

ns

Port-Select Hold Time

T9

30

ns

Busy Bit Delay

T13

(Note 3)

ns

WR Pulse Width

T14

100

ns

Write Data Setup Time

T15

50

ns

Write Data Hold Time

T16

120

ns

Write Recovery Time

T18

120

ns

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating

the device beyond the above Operating Ratings.

Note 2: When operating at ambient temperatures above 70˚C, the device must be protected against excessive junction temperatures. Mounting the package on a

printed circuit board having an area greater than three square inches and surrounding the leads and body with wide copper traces and large, uninterrupted areas of

copper, such as a ground plane, suffices. The 28-pin DIP (N) and the 24-pin surface mount package (M) are molded plastic packages with solid copper lead frames.

Most of the heat generated at the die flows from the die, through the copper lead frame, and into copper traces on the printed circuit board. The copper traces act

as a heat sink. Double-sided or multi-layer boards provide heat transfer characteristics superior to those of single-sided boards.

Note 3: In order to read the busy bit, the status byte must first be read. The time required to read the busy bit far exceeds the time the chip requires to set the busy

bit. It is, therefore, impossible to test actual busy bit delay. The busy bit is guaranteed to be valid as soon as the user is able to read it.

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