MB91F577CPMC datasheet(51/163 Pages) CYPRESS

51 / 163 page

Document Number: 002-04725 Rev.*A

Page 51 of 163

MB91570 Series

Precautions Related to Usage of Devices

Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office

equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).

CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly

affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as

aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.)

are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from

such use without prior approval.

7.2

Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you

should only mount under Cypress's recommended conditions. For detailed information about mount conditions, contact your sales

representative.

Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or

mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow

soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected

to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress

recommended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact

deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be

verified before mounting.

Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed

or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections

caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of

mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended

conditions.

Lead-Free Packaging

CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength

may be reduced under some conditions of use.

Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of

moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing

moisture resistance and causing packages to crack. To prevent, do the following:

1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in

locations where temperature changes are slight.

2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C

and 30°C.

When you open Dry Package that recommends humidity 40% to 70% relative humidity.

3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica

gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.

4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended

conditions for baking.

Condition: 125°C/24 h

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