TMP93CS20F datasheet(21/48 Pages) TOSHIBA

Part #	TMP93CS20F

Description	Quality And Reliability Assurance / Handling Precautions

PDF	48 Pages

Scroll/Zoom	100%

Manufacturer	TOSHIBA [Toshiba Semiconductor]

Direct Link	http://www.semicon.toshiba.co.jp/eng

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21 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-21

2002-02-20

Table 2.8

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (3/3)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP47C660AF

P-QFP64-1420-1.00A

A(168h)

TMP47C860AF

P-QFP64-1420-1.00A

A(168h)

TMP47P860VF

P-QFP64-1420-1.00A

TMP47C1220F

P-QFP80-1420-0.80B

A(168h)

TMP47C1620F

P-QFP80-1420-0.80B

A(168h)

TMP47P1620VF

P-QFP80-1420-0.80B

B(72h)

TMP47C1260F

P-QFP64-1420-1.00A

A(168h)

TMP47C1660F

P-QFP64-1420-1.00A

A(168h)

TMP47P1660VF

P-QFP64-1420-1.00A

B(72h)

Note 1:

As of March, 2001

Note 2:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

TMP93CS20F Datasheet(PDF) 21 Page - Toshiba Semiconductor

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