STM32L100RB datasheet(44/103 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L100C6 STM32L100R8/RB

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DocID024295 Rev 5

6.3

Operating conditions

6.3.1

General operating conditions

Table 11. Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

105

°C

TLEAD

Maximum lead temperature during soldering

(LQFP64, UFQFPN48)

see note (1)

1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®

7191395 specification, and the European directive on Restrictions on Hazardous Substances (ROHS

directive 2011/65/EU, July 2011).

°C

Table 12. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

BOR detector enabled,

(at power-on)

1.8

3.6

BOR detector disabled, after

power on

1.65

3.6

VDDA(1) Analog operating voltage

Must be the same voltage as

VDD(2)

1.8

3.6

VIN

I/O input voltage

FT pins: 2.0 V ≤VDD

–0.3

5.5(3)

FT pins: VDD < 2.0 V

–0.3

5.25(3)

BOOT0

5.5

Any other pin

–0.3

VDD+0.3

Power dissipation at TA = 85 °C(4)

LQFP64 package

444

UFQFPN48 package

606

Ambient temperature range

Maximum power dissipation

–40

Junction temperature range

-40 °C ≤ TA ≤ 85°C

-40

105

°C

1. When the ADC is used, refer to Table 53: ADC characteristics.

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and

VDDA can be tolerated during power-up and operation.

3. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Section 7.3: Thermal characteristics

on page 97).

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