M34E02-F datasheet(34/36 Pages) STMICROELECTRONICS

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Revision history

M34E02-F

34/36

DocID10367 Rev 14

18-Mar-2009

Datasheet title and Features on page 1 modified: the device can be used

with DDR1 and DDR2 DRAM configurations.

Temperature range 6 added, operating voltage range VCC extended in

device temperature range 6. IOL added to and TA modified in Table 7:

Absolute maximum ratings.

ILO, ICC and VIL modified in Table 13: DC characteristics (for temperature

range 6 devices). Table 14: AC characteristics added. Table 13: DC

characteristics (for temperature range 6 devices) modified. Figure 13: AC

waveforms modified.

Figure 4: Maximum RP value versus bus parasitic capacitance (C) for an

I2C bus updated. Note removed below Figure 11: Serial presence detect

block diagram.

UFDFPN8 package specifications updated (see Table 15: UFDFPN8

(MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm,

data).

Blank option removed under plating technology in Table 17: Ordering

information scheme. Small text changes.

25-Sep-2009

Section 2.5.2: Power-up conditions and Section 2.5.3: Device reset

updated. Figure 4: Maximum RP value versus bus parasitic capacitance

tNS modified in Table 11: Input parameters.

ICC and VIL test conditions extended in Table 12: DC characteristics (for

temperature range 1 devices).

01-Apr-2010

Test condition updated in Table 12: DC characteristics (for temperature

range 1 devices) and Table 13: DC characteristics (for temperature range

6 devices)

Updated Figure 14: UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual

flat package no lead 2 x 3 mm, outline and Table 15: UFDFPN8 (MLP8) 8-

lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data

23-Jul-2010

Added M34E02-F part number.

Added ambient temperature with power applied in Table 7: Absolute

maximum ratings.

Updated ICC1 conditions in Table 12: DC characteristics (for temperature

range 1 devices).

Added Note 4 for tCLQV in Table 14: AC characteristics. Updated

Figure 13: AC waveforms.

tCHDX replaced by tCHDL in Figure 13: AC waveforms.

Modified MC package outline in Figure 14: UFDFPN8 (MLP8) – 8-lead

ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline.

27-May-2011

Updated MLP8 package data.

22-Jan-2013

Removed M34E02 part number.

Updated information relating to package UFDFPN8 (MLP8).

Rephrased Description.

Updated Table 7: Absolute maximum ratings and Table 13: DC

characteristics (for temperature range 6 devices).

Table 18. Document revision history (continued)

Date

Revision

Changes

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