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SW7960U Datasheet(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

Part # SW7960U
Description  Dual N-channel Enhanced mode SO-8 MOSFET
PDF  6 Pages
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Manufacturer  SEMIPOWER [Xian Semipower Electronic Technology Co., Ltd.]
Direct Link  http://www.samwinsemi.com
Logo SEMIPOWER - Xian Semipower Electronic Technology Co., Ltd.

SW7960U Datasheet(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

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Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
Aug. 2016. Rev. 2.0
1/6
SW7960U
Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
DSS
Drain to source voltage
60
V
I
D
Continuous drain current (@T
C=25
oC)
8*
A
Continuous drain current (@T
C=100
oC)
5*
A
I
DM
Drain current pulsed
(note 1)
32
A
V
GS
Gate to source voltage
± 20
V
E
AS
Single pulsed avalanche energy
(note 2)
588
mJ
E
AR
Repetitive avalanche energy
(note 1)
18
mJ
dv/dt
Peak diode recovery dv/dt
(note 3)
5
V/ns
P
D
Total power dissipation (@T
C=25
oC)
1.36
W
Derating factor above 25oC
0.01
W/oC
T
STG, TJ
Operating junction temperature & storage temperature
-55 ~ + 150
oC
T
L
Maximum lead temperature for soldering
purpose, 1/8 from case for 5 seconds.
300
oC
Thermal characteristics
Symbol
Parameter
Value
Unit
R
thja
Thermal resistance, Junction to ambient
92
oC/W
*. Drain current is limited by junction temperature.
Order Codes
Item
Sales Type
Marking
Package
Packaging
1
SW HB 7960U
SW7960U
SO-8
REEL
Dual N-channel Enhanced mode SO-8 MOSFET
Features
 High ruggedness
 Low R
DS(ON) (Typ 14mΩ)@VGS=10V
(Typ 16m
Ω)@V
GS=4.5V
 Low Gate Charge (Typ 58nC)
 Improved dv/dt Capability
 100% Avalanche Tested
 Application:DC-DC Converter, Inverter,
Synchronous Rectification
General Description
This power MOSFET is produced with advanced technology of SAMWIN.
This technology enable the power MOSFET to have better characteristics, including fast
switching time, low on resistance, low gate charge and especially excellent avalanche
characteristics.
BV
DSS : 60V
I
D
: 8A
R
DS(ON) : 14mΩ@VGS=10V
16m
Ω@V
GS=4.5V
G1(2)
G2(4)
D1(7,8)
D2(5,6)
S1(1)
S2(3)
SO-8 (Bottom View)
Note: R
thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d
efined as the solder mounting surface of the drain pins. R
thjc is guaranteed by design while Rthca is determined by the user's
board design. 92 oC/W on a 1 in2 pad of 2oz copper.


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