AWB578 datasheet(12/13 Pages) ASB

12 / 13 page

12/13

ASB Inc.

 sales@asb.co.kr

April 2017

AWB578

6. Package Outline (SOIC8)

7. Surface Mount Recommendation (In mm)

Symbols

Dimensions (In mm)

MIN

NOM

MAX

1.40

1.50

1.60

0.00

---

0.10

---

1.45

---

0.33

---

0.51

0.19

---

0.25

4.80

---

5.00

3.20

3.30

3.40

5.80

6.00

6.20

3.80

3.90

4.00

2.30

2.40

2.50

---

1.27

---

0.40

---

1.27

---

0.10





---



L1-L1

---

0.12

1.04REF

NOTE

1. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

2. To ensure reliable operation, device ground

paddle-to-ground pad soldering is critical.

3. Add mounting screws near the part to fasten the

board to a heat sinker. Ensure that the ground &

thermal via region contacts the heat sinker.

4. A proper heat dissipation path underneath the area

of the PCB for the mounted device is strictly

required for proper thermal operation. Damage to

the device can result from inappropriate heat

dissipation.

le is RF and DC ground.

Part No.

AWB578 Datasheet(PDF) 12 Page - Advanced Semiconductor Business Inc.

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