MPXM2102AS datasheet(575/670 Pages) MOTOROLA

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Motorola Sensor Device Data

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PACKAGE OUTLINE DIMENSIONS (continued)

BASIC ELEMENT (A, D)

CASE 867–08

ISSUE N

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

PIN 1

–A–

123

6 PL

SEATING

PLANE

–T–

0.136 (0.005)

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

0.595

0.630

15.11

16.00

0.514

0.534

13.06

13.56

0.200

0.220

5.08

5.59

0.027

0.033

0.68

0.84

0.048

0.064

1.22

1.63

0.100 BSC

2.54 BSC

0.014

0.016

0.36

0.40

0.695

0.725

17.65

18.42

30 NOM

0.475

0.495

12.07

12.57

0.430

0.450

10.92

11.43

0.090

0.105

2.29

2.66

POSITIVE PRESSURE

(P1)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION –A– IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO

EXCEED 16.00 (0.630).

PRESSURE SIDE PORTED (AP, GP)

CASE 867B–04

ISSUE F

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

SEATING PLANE

PIN 1

0.25

0.173

Q S

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONS AND TOLERANCES PER ASME

Y14.5M, 1994.

DIM

MIN

MAX

MILLIMETERS

29.08

29.85

17.4

18.16

7.75

8.26

0.68

0.84

1.22

1.63

2.54 BSC

0.36

0.41

17.65

18.42

7.37

7.62

10.67

11.18

3.89

4.04

3.89

4.04

5.84

6.35

5.59

6.1

23.11 BSC

4.62

4.93

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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