MPXM2102AS datasheet(579/670 Pages) MOTOROLA

579 / 670 page

3–433

Motorola Sensor Device Data

www.motorola.com/semiconductors

PACKAGE OUTLINE DIMENSIONS (continued)

CASE 1317A–01

ISSUE A

0.025

0.130

0.050

0.004

0.390

0.325

NOTES:

1. ALL DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M–1994.

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006 INCHES PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5

° MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE .008 INCHES MAXIMUM.

0.004

0.006

GAGE

PLANE

DETAIL E

0.048

0.010

.014

8X 0.014

DETAIL E

SEATING

PLANE

0.018

0.345

0.325

0.345

0.400

0.420

0.110

0.370

0.002

0.038

0.200

0.180

0.280

0.300

0.280

0.300

BOTTOM VIEW

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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