| Manufacturer | Part # | Datasheet | Description |
 Greystone Energy System... |
TSSO
|
297Kb/2P |
STRAP-ON TEMPERATURE SENSOR
|
 STMicroelectronics |
TSSO20
|
57Kb/4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Amkor Technology |
TSSOP
|
780Kb/3P |
ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based
12/21 |
|
TSSOP
|
411Kb/2P |
Silver Wirebonding
02/22 |
|
TSSOP
|
502Kb/2P |
TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages
12/21 |
 TT Electronics. |
TSSOP
|
562Kb/4P |
Surface Mount TSSOP Resistor Networks
08.21 |
 Diodes Incorporated |
TSSOP-14
|
188Kb/14P |
SUGGESTED PAD LAYOUT
Rev 43 |
|
TSSOP-14
|
404Kb/27P |
SUGGESTED PAD LAYOUT
Rev 52 |
 Global Mixed-mode Techn... |
TSSOP-14
|
171Kb/1P |
Package Outline
|
|
TSSOP-14-EP
|
121Kb/1P |
Package Outline
|
 International Rectifier |
TSSOP-14PIN
|
19Kb/1P |
TSSOP Package 14-Pin
|
 Diodes Incorporated |
TSSOP-16
|
404Kb/27P |
SUGGESTED PAD LAYOUT
Rev 52 |
 Torex Semiconductor |
TSSOP-16
|
205Kb/3P |
Reference Pattern Layout Dimensions
|
 Global Mixed-mode Techn... |
TSSOP-16
|
113Kb/1P |
Package Outline
|
 RF Monolithics, Inc |
TSSOP-16
|
138Kb/3P |
16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint
|
 Global Mixed-mode Techn... |
TSSOP-16-EP
|
244Kb/1P |
Package Outline
|
 Diodes Incorporated |
TSSOP-16EP
|
404Kb/27P |
SUGGESTED PAD LAYOUT
Rev 52 |
|
TSSOP-20
|
404Kb/27P |
SUGGESTED PAD LAYOUT
Rev 52 |
 Global Mixed-mode Techn... |
TSSOP-20
|
114Kb/1P |
Package Outline
|
 List of Unclassifed Man... |
TSSOP-20
|
56Kb/2P |
Mechanical Dimensions
|