APPLICATIONS
Mobile and consumer products, baseband, RF/wireless, analog, power management
ASIC, MEMS, sensors, system solutions for medical, security, encryption, DC/DC converter, radar and automotive
Electro-optical WLSiP, solutions for M2M communication and Internet of Things (IoT)
Extension of the technology platform to a wider field of application areas is ongoing

Design Features
Package size: 2 x 3 mm2 - 33 x 28 mm2
Package thickness: 0.275 mm (WLSiP – Multi-chip module) to 1.900 mm (WL3D)
WLSiP with up to 10 active dies and 50 passives qualified
Minimum through package via pitch: 0.350 mm
BGA pitch: down to 0.350 μm
Minimum die-to-die distance: 0.100 mm
Minimum passive-to-die and passive-to-passive distance: 0.150 mm
Minimum die TPV pad pitch: 0.050 mm and opening 0.045 mm
Bottom side Cu-RDL minimum line/space: 0.010 mm/0.010 mm, multi-layer RDL
Top side Cu-RDL minimum line/space: 0.020 mm/0.020 mm, single-layer RDL