Embedded Wafer Level System Integration

Amkor Technology was among the first in the world to offer Wafer Level Fan-

Out (WLFO) packaging, enabling a wide range of embedded heterogeneous

system integration package solutions. These include: Wafer Level System-in-

Package (WLSiP) a single or multiple die, with or without passives or sensors

integration and 3D package stacking solutions (WL3D), including wafer level

Package-on-Package (PoP) and face-to-face package assembly.

Tailoring the best solutions requires a deep understanding of customer

needs. Amkor’s package solutions are collaboratively developed, which often

involves cooperation from the earliest stage of the chip-package-board co-

design. Amkor is recognized for its proficiency in advanced packaging, and

is known for a portfolio of innovative solutions manufactured in volume.

These include the largest reliable WLCSP to date.

By relying on an experienced in-house R&D team to design and develop

innovative package and system solutions for a wide range of applications,

we enable products from concept to market.

As a leader in wafer-level packaging, Amkor offers world-class, turnkey

solutions on state-of-the-art 300 mm wafer-processing equipment. In

addition, we consistently deliver the best results in key metrics such as time

to market, cost efficiency and yield.

Reliability: Board Level Tests

With a wide range of different WLSiP and WL3D package constructions and

configurations possible, customer requirements are implemented in each

product developed and reliability results are realized based on technical

capabilities.

WLSiP & WL3D

DATA SHEET | WAFER LEVEL PRODUCTS

Test

Specification

Criteria

Lower Complexity WLSiP

Temperature Cycling on Board

(TCoB)

IPC-9701 Condition TC3

-40°C/+125°C, 1 Cy/Hr

1000x

Drop Test (DT)

JEDEC JESD-22-B111

100 Drops

Higher Complexity WL3D

Temperature Cycling on Board

(TCoB)

IPC-9701 Condition TC3

-40°C/+125°C, 1 Cy/Hr

1000x

Drop Test (DT)

JEDEC JESD-22-B111

30 Drops

Temperature Humidity Bias

(THB)

JEDEC JESD-22-A101

85°C/85% RH/Vcc, 1000 Hours

ADVANCED PACKAGING

SOLUTIONS

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WLSiP side-by-side multi-chip modules

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WLSiP with passives and leadless

package integration

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Portfolio of WLSiP configurations

range from 2 x 3 mm2 (2 components)

to 33 x 28 mm2 (10 components)

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WL3D Package-on-Package (PoP)

achieved by stacking WLSiP and other

package types using Through Package

Vias (TPV)

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3D integration realized by F2F

assembly of flip chip to WLFO package

APPLICATIONS

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Mobile and consumer products,

baseband, RF/wireless, analog, power

management

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ASIC, MEMS, sensors, system solutions

for medical, security, encryption,

DC/DC converter, radar and

automotive

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Electro-optical WLSiP, solutions for

M2M communication and Internet of

Things (IoT)

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Extension of the technology platform

to a wider field of application areas is

ongoing