description
The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three chips can be attached. Multiple chip devices can be series or parallel connected.
   
features
• ±70° emission angle
• wide variety of chip combinations
• wide variety of lenses and apertures