Electronic Components Datasheet Search
  British  ▼
ALLDATASHEET.CO.UK

X  

AD5522JSVDZ Datasheet(PDF) 16 Page - Analog Devices

Part # AD5522JSVDZ
Description  Quad Parametric Measurement Unit with Integrated 16-Bit Level Setting DACs
PDF  65 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5522JSVDZ Datasheet(HTML) 16 Page - Analog Devices

Back Button AD5522JSVDZ Datasheet HTML 12Page - Analog Devices AD5522JSVDZ Datasheet HTML 13Page - Analog Devices AD5522JSVDZ Datasheet HTML 14Page - Analog Devices AD5522JSVDZ Datasheet HTML 15Page - Analog Devices AD5522JSVDZ Datasheet HTML 16Page - Analog Devices AD5522JSVDZ Datasheet HTML 17Page - Analog Devices AD5522JSVDZ Datasheet HTML 18Page - Analog Devices AD5522JSVDZ Datasheet HTML 19Page - Analog Devices AD5522JSVDZ Datasheet HTML 20Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 16 / 65 page
background image
Data Sheet
AD5522
Rev. E | Page 15 of 64
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage, AVDD to AVSS
34 V
AVDD to AGND
−0.3 V to +34 V
AVSS to AGND
+0.3 V to −34 V
VREF to AGND
−0.3 V to +7 V
DUTGND to AGND
AVDD + 0.3 V to AVSS − 0.3 V
REFGND to AGND
AVDD + 0.3 V to AVSS − 0.3 V
DVCC to DGND
−0.3 V to +7 V
AGND to DGND
−0.3 V to +0.3 V
Digital Inputs to DGND
−0.3 V to DVCC + 0.3 V
Analog Inputs to AGND
AVSS − 0.3 V to AVDD + 0.3 V
Storage Temperature Range
−65°C to +125°C
Operating Junction Temperature
Range (J Version)
25°C to 90°C
Reflow Soldering
JEDEC Standard (J-STD-020)
Junction Temperature
150°C max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal resistance values are specified for the worst-case
conditions, that is, a device soldered in a circuit board for
surface-mount packages.
Table 5. Thermal Resistance1 (JEDEC 4-Layer (1S2P) Board)
Package Type
Airflow
(LFPM)
θJA
θJC
Unit
TQFP Exposed Pad on Bottom
4.8
°C/W
No Heat Sink2
0
22.3
°C/W
200
17.2
°C/W
500
15.1
°C/W
With Cooling Plate at 45°C3
N/A4
5.4
4.8
°C/W
TQFP Exposed Pad on Top
2
°C/W
No Heat Sink2
0
42.4
°C/W
200
37.2
°C/W
500
35.7
°C/W
With Cooling Plate at 45°C3
N/A4
3.0
2
°C/W
1
The information in this section is based on simulated thermal information.
2
These values apply to the package with no heat sink attached. The actual
thermal performance of the package depends on the attached heat sink and
environmental conditions.
3
Natural convection at 55°C ambient. Assumes perfect thermal contact
between the cooling plate and the exposed paddle.
4
N/A means not applicable.
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com