MPQ8632 datasheet(7/47 Pages) MPS

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MPQ8632 HIGH EFFICIENCY 18V SYNCHRONOUS STEP-DOWN CONVERTER FAMILY FOR 4A TO 20A

MPQ8632 Rev.1.26

www.MonolithicPower.com

6/7/2017

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 21V

VSW........................................-0.3V to VIN + 0.3V

VSW (30ns)...................................-3V to VIN + 3V

VBST ...................................................... VSW + 6V

VBST (30ns) ........................................ VSW + 6.5V

Enable Current IEN

(2)................................ 2.5mA

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation (TA=+25)

(3)

QFN3X4……………………….…..…………2.7W

QFN5X4……………………….…..…………3.3W

Junction Temperature...............................150

C

Lead Temperature ....................................260

C

Storage Temperature............... -65

C to +150C

Recommended Operating Conditions

(4)

Supply Voltage VIN ...........................4.5V to 18V

Output Voltage VOUT.....................0.611V to 13V

Enable Current IEN...................................... 1mA

Operating Junction Temp. (TJ).-40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN (3x4mm)......................... 46 ....... 9....

C/W

QFN (5x4mm)......................... 38 ....... 6....

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Refer to the section “Configuring the EN Control”.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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