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LTC7130 Datasheet(PDF) 2 Page - Linear Technology |
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LTC7130 Datasheet(HTML) 2 Page - Linear Technology |
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2 / 36 page ![]() LTC7130 2 7130fb For more information www.linear.com/LTC7130 ABSOLUTE MAXIMUM RATINGS Input Supply Voltage.................................. –0.3V to 20V EXTVCC, RUN, PGOOD................................. –0.3V to 6V SNSD+, SNSA+, SNS– Voltages.............–0.3V to INTVCC MODE/PLLIN, ILIM, TK/SS, FREQ.........–0.3V to INTVCC DIFFP, DIFFN .........................................–0.3V to INTVCC ITEMP, ITH, VFB Voltages......................–0.3V to INTVCC Operating Junction Temperature Range (Note 2).................................................. –40°C to 125°C Storage Temperature Range .................. –65°C to 150°C Peak Solder Reflow Body Temperature .................260°C (Note 1) ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VRUN = 5V unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Main Control Loops VIN Input Voltage Range (Note 3) 4.5 20 V VOUT Output Voltage Range with Diffamp Low DCR Sensing without Diffamp and No Low DCR Sensing 0.6 0.6 3.5 5.5 V V VFB Regulated Feedback Voltage Current ITH Voltage = 1.2V (Note 4) –40°C to 85°C –40°C to 125°C l l 0.597 0.5955 0.6 0.6 0.603 0.6045 V V 1 A B C D E F G H J 2 3 4 TOP VIEW BGA PACKAGE 63-PIN (6.25mm × 7.5mm × 2.22mm) 5 6 7 VIN SW INTVCC GND GND BOOST SGND NC1 NC2 DIFFN DIFFP DIFFOUT ITH VFB SNSD+ FREQ SNS– TK/SS RUN SNSA+ ITEMP ILIM CLKOUT MODE/ PLLIN SVIN EXTVCC PGOOD TJMAX = 125°C, θJA = 21°C/W, θJC = 10°C/W θJA DERIVED FROM LTC7130 DEMO BOARD, Weight = 0.24g PIN CONFIGURATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (SEE NOTE 2) DEVICE FINISH CODE LTC7130EY#PBF SAC305 (RoHS) LTC7130 e1 BGA 3 –40°C to 125°C LTC7130IY#PBF SAC305 (RoHS) LTC7130 e1 BGA 3 –40°C to 125°C • Device temperature grade is indicated by a label on the shipping container. • Pad or ball finish code is per IPC/JEDEC J-STD-609. • Terminal Finish Part Marking: www.linear.com/leadfree • This product is not recommended for second side reflow. For more information, go to www.linear.com/BGA-assy • Recommended BGA PCB Assembly and Manufacturing Procedures: www.linear.com/BGA-assy • BGA Package and Tray Drawings: www.linear.com/packaging • This product is moisture sensitive. For more information, go to: www.linear.com/BGA-assy ORDER INFORMATION (http://www.linear.com/product/LTC7130#orderinfo) |
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