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LT3840

3840fa

For more information www.linear.com/LT3840

package DescripTion

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

FE28 (EA) TSSOP REV K 0913

0.09 – 0.20

(.0035 – .0079)

° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

3 4 5 6 7 8 9 10 11 12 13 14

22 21

18 17

9.60 – 9.80*

(.378 – .386)

7.56

(.298)

3.05

(.120)

28 2726 25 24 23

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

RECOMMENDED SOLDER PAD LAYOUT

EXPOSED

PAD HEAT SINK

ON BOTTOM OF

PACKAGE

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

7.56

(.298)

3.05

(.120)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC

FE Package

28-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663 Rev K)

Exposed Pad Variation EA

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