7.

Package Drawings

7.1

8 Pin UDFN Package Drawing

B

A

0.10 C

0.10 C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

12

N

2X

TOP VIEW

SIDE VIEW

NOTE 1

12

N

0.10

C A B

0.10

C A B

0.10 C

0.08 C

Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2

2X

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]

Atmel Legacy YNZ Package

© 2017 Microchip Technology Inc.

D

E

D2

E2

K

L

8X b

e

e

2

0.10

C A B

0.05

C

A

(A3)

A1

BOTTOM VIEW

ATTPM20P

Package Drawings

Datasheet Summary

DS40002082A-page 13