1 MHz Bandwidth, Galvanically Isolated

Current Sensor IC in SOIC-16 Package

ACS732KMA and

ACS733KMA

21

Allegro MicroSystems

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A.

www.allegromicro.com

Figure 15: Package MA, 16-Pin SOICW

PACKAGE OUTLINE DRAWING

C

SEATING

PLANE

1.27 BSC

GAUGE PLANE

SEATING PLANE

A Terminal #1 mark area

B

Reference land pattern layout (reference IPC7351

SOIC127P600X175-8M); all pads a minimum of 0.20 mm from all

adjacent pads; adjust as necessary to meet application process

requirements and PCB layout tolerances

PCB Layout Reference View

B

C

C

2

1

16

Branding scale and appearance at supplier discretion

C

SEATING

PLANE

C

0.10

16×

0.25 BSC

1.40 REF

2.65 MAX

For Reference Only; not for tooling use (reference MS-013AA)

Dimensions in millimeters

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

10.30 ±0.20

7.50 ±0.10

10.30 ±0.33

0.51

0.31

0.30

0.10

0.33

0.20

1.27

0.40

8°

0°

Line 1: Part Number

Line 2: First 9 characters of Assembly Lot Number

1

A

Standard Branding Reference View

2

1

16

0.65

1.27

9.50

2.25

ACS732

Lot Number

1

ACS733

Lot Number

ACS732 (5 V)

ACS733 (3.3 V)

2

1

16

0.65

1.27

9.75

1.65

High-Isolation PCB Layout Reference View

D Hall elements (D1, D2); not to scale

D

D2

D1

0.454

1.407

D

D

Branded Face