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M24128X-FCU6/TF Datasheet(PDF) 26 Page - STMicroelectronics |
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M24128X-FCU6/TF Datasheet(HTML) 26 Page - STMicroelectronics |
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26 / 35 page ![]() Table 17. Ultra thin WLCSP- 4-bump, 0.851 x 0.851 mm, wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.240 0.270 0.300 0.0094 0.0106 0.0118 A1 - 0.095 - - 0.0037 - A2 - 0.175 - - 0.0079 - b(2)(3) - 0.185 - - 0.0073 - D - 0.851 0.871 - 0.0335 0.0343 E - 0.851 0.871 - 0.0335 0.0343 e - 0.400 - - 0.0157 - e1 - 0.500 - - 0.0197 - F - 0.226 - - 0.0089 - G - 0.176 - - 0.0069 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. M24128X-FCU Ultra thin WLCSP4 package information DS12680 - Rev 2 page 26/35 |
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