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ESDA09 Datasheet(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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ESDA09 Datasheet(HTML) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2 / 5 page ![]() 1-3 Reliability testing procedures Reliability parameter Test Test methods and remarks Test requirement Pulse current capability Imax 8/20 ㎲ IEC 1051-1, Test 4.5. 10 pulses in the same direction at 2 pulses per minute at maximum peak current d Vn/Vn≤10% no visible damage Electrostatic discharge capability ESD C=150 pF, R=330Ω IEC 1000-4-2 Each 10 times in positive/negative direction in 10 sec at 8KV contact discharge (Level 4) d Vn/Vn≤10% no visible damage Environmenta l reliability Thermal shock IEC 68-2-14 Condition for 1 cycle Step 1 : Min. –40℃, 30±3 min. Step 2 : Ma x. +125℃, 30±3 min. Number of cycles: 30 times d Vn/Vn≤5% no visible damage Low temperature IEC 68-2-1 Place the chip at -40±5℃ for 1000± 12hrs. Remove and place for 24±2hrs at room temp. condition, then measure d Vn/Vn≤5% no visible damage High temperature IEC 68-2-2 Place the chip at 125±5℃ for 1000± 24hrs. Remove and place for 24±2hrs at room temp. condition, then measure d Vn/Vn≤5% no visible damage Heat resistance IEC 68-2-3 Apply the rated voltage for 1000±48hrs at 85±3℃. Remove and place for 24± 2hrs at room temp. condition, then measure d Vn/Vn≤5% no visible damage Humidity resistance IEC 68-2-30 Place the chip at 40±2℃ and 90 to 95% humidity for 1000±24hrs. Remove and place for 24±2hrs at room temp. condition, then measure d Vn/Vn≤10% no visible damage Pressure cooker test Place the chip at 2 atm, 120℃, 85%RH for 60 hrs. Remove and place for 24± 2hrs at room temp. condition, then measure d Vn/Vn≤10% no visible damage Operating life Apply the rated voltage for 1000±48hrs at 125±3℃. Remove and place for 24± 2hrs at room temp. condition, then measure d Vn/Vn≤10% no visible damage ESDA09 Rev : www.leiditech.com 01.06.2015 2/5 |
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