ESDA09 datasheet(3/5 Pages) LEIDITECH

Part #	ESDA09

Description	Rated peak single pulse transient current Capacitance

PDF	5 Pages

Scroll/Zoom	100%

Manufacturer	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

Direct Link	http://www.leiditech.com

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3 / 5 page

ESD

Mechanical

Reliability

Solderability

IEC 68-2-58

Solder bath method, 230±5℃, 2s

At least 95% of terminal

electrode is covered by

new solder

Resistance to

soldering heat

IEC 68-2-58

Solder bath method,

260±5℃, 10±0.5s, 270±5℃, 3±0.5s

Vn/Vn≤5%

no visible damage

Bending strength

IEC 68-2-21

Warp:2mm, Speed:0.5mm/sec, Duration:

10sec. The measurement shall be made

with board in the bent position

Vn/Vn≤5%

no visible damage

Adhesive strength

IEC 68-2-22

Applied force on SMD chip by fracture

from PCB

Strength>10 N

no visible damage

2. Material Specification

Body

ZnO based ceramics

Internal electrode

Silver

– Palladium

External electrode

Silver

– Nickel – Tin

Thickness of Ni/Sn plating layer

Nickel ＞ 1 ㎛, Tin ＞ 2 ㎛

3. Dimension Specification

4. Soldering Recommendations

4-1 Soldering profile

Size

L(mm)

W(mm)

T(mm)

M(mm)

0402

1.0±0.10

0.5±0.10

≤ 0.6

0.20±0.10

0603

1.6±0.15

0.8±0.15

≤ 0.9

0.35±0.10

ESDA09

Rev :

www.leiditech.com

01.06.2015

3/5

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