MCP660T-ESLASHST datasheet(34/68 Pages) MICROCHIP

34 / 68 page

MCP660/1/2/3/4/5/9

DS20002194E-page 34

 2009-2014 Microchip Technology Inc.

6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

0.95 BSC

Outside Lead Pitch

1.90 BSC

Overall Height

0.90

–

1.45

Molded Package Thickness

0.89

–

1.30

Standoff

0.00

–

0.15

Overall Width

2.20

–

3.20

Molded Package Width

1.30

–

1.80

Overall Length

2.70

–

3.10

Foot Length

0.10

–

0.60

Footprint

0.35

–

0.80

Foot Angle

0°

–

30°

Lead Thickness

0.08

–

0.26

Lead Width

0.20

–

0.51

PIN1IDBY

LASER MARK

Microchip Technology Drawing C04-028B

MCP660T-E/ST Datasheet(PDF) 34 Page - Microchip Technology

MCP660T-E/ST Datasheet(HTML) 34 Page - Microchip Technology

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