AT25SL321 datasheet(2/82 Pages) DIALOG

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DS-25SL321–112H–10/2020

DATASHEET

AT25SL321

32-Mbit, 1.7 V Minimum SPI Serial Flash Memory

with Dual I/O, Quad I/O and QPI Support

Features



Single 1.7 V - 2.0 V Supply



Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible

- Supports SPI Modes 0 and 3

- Supports Dual Output Read and Quad I/O Program and Read

- Supports QPI Program and Read

- 104 MHz Maximum Operating Frequency

- Clock-to-Output (t

V1) of 6 ns

- Up tp 65 Mbytes/s continuous data transfer rate



Full Chip Erase



Flexible, Optimized Erase Architecture for Code and Data Storage Applications

- 0.6 ms Typical Page Program (256 bytes) Time

- 60 ms Typical 4 kbyte Block Erase Time

- 200 ms Typical 32 kbyte Block Erase Time

- 300 ms Typical 64 kbyte Block Erase Time



Hardware Controlled Locking of Protected Blocks via WP Pin



4 kbit secured One-Time Programmable Security Register



Hardware Write Protection



Serial Flash Discoverable Parameters (SFDP) Register



Flexible Programming

- Byte/Page Program (1 to 256 bytes)

- Dual or Quad Input Byte/Page Program (1 to 256 bytes)

- Accelerated programming mode via 9V ACC pin



Erase/Program Suspend and Resume



JEDEC Standard Manufacturer and Device ID Read Methodology



Low Power Dissipation

- 2 µA Deep Power-Down Current (Typical)

- 10 µA Standby current (Typical)

- 5 mA Active Read Current (Typical)



Endurance: 100,000 program/erase cycles (4, 32, or 64 kbyte blocks)



Data Retention: 20 Years



Industrial Temperature Range: -40 °C to +85 °C



Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

- 8S4, 8-lead SOIC (208-mil)

- 8MA1, 8-pad UDFN (6 x 5 x 0.6 mm)

- 8MA2, 8-pad USON(3 x 4 x 0.55 mm)

- 8S1, 8-lead SOIC (150 mil)

- 8-ball WLCSP, die Ball Grid Array (dBGA)

AT25SL321 Datasheet(PDF) 2 Page - Dialog Semiconductor

AT25SL321 Datasheet(HTML) 2 Page - Dialog Semiconductor

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