XC61F datasheet(8/12 Pages) TOREX

8 / 12 page

XC61F Seires

164

■Directions for use

GNotes on Use

VIN

VOUT

VSS

RIN

XC61FN Series

CIN

VIN

VOUT

VSS

RIN

XC61FC Series

CIN

■備考

1. Oscillation

(1) Oscillation as a result of output current with the CMOS output configuration :

(2) Oscillation as a result of through current :

Diagram1. When using an input resistor

Please use this IC within the stated maximum ratings. The IC is liable to malfunction should the ratings be exceeded.

When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may occur

as a result of voltage drops at RIN if load current (IOUT) exists.

It is therefore recommend that no resistor be added. ( refer to N.B. 1 - (1) below )

When a resistor is connected between the VIN pin and the input with CMOS output configurations, irrespective of N-ch

output configurations, oscillation may occur as a result of through current at the time of voltage release even if load

current (IOUT ) does not exist. ( refer to N.B. 1 - (2) below )

With a resistor connected between the VIN pin and the input, detect and release voltage will rise as a result of the IC's

supply current flowing through the VIN pin.

If a resistor (RIN ) must be used, then please use with as small a level of input impedance as possible in order to control

the occurences of oscillation as described above.

Further, please ensure that RIN is less than 10k

Ω and that CIN is more than 0.1µF (Diagram 1). In such cases, detect and

release voltages will rise due to voltage drops at RIN brought about by the IC's supply current.

Depending on circuit's operation, transient delay time of this IC can be widely changed due to upper limits or lower limits

of operational ambient temparature.

When the voltage applied at IN rises, release operations commence and the detector's output voltage increases. Load

current (IOUT) will flow through RL. Because a voltage drop ( RIN x IOUT) is produced at the RIN resistor, located between

the input (IN) and the VIN pin, the load current will flow via the IC's VIN pin. The voltage drop will also lead to a fall in the

voltage level at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect operations will

commence. Following detect operations, load current flow will cease and since voltage drop at RIN will disappear, the

voltage level at the VIN pin will rise and release operations will begin over again.

Oscillation may occur with this " release - detect - release " repetition.

Further, this condition will also appear via means of a similar mechanism during detect operations.

Since the XC61F series are CMOS ICS, through current will flow when the IC's internal circuit switching operates ( during

release and detect operations ). Consequently, oscillation is liable to occur during release voltage operations as a result

of output current which is influenced by this through current ( Diagram 3 ).

Since hysteresis exists during detect operations, oscillation is unlikely to occur.

GN.B.

02S_04XC61F 02.09.12 14:04 ページ 164

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