VITESSE

SEMICONDUCTOR CORPORATION

Data Sheet

VSC8021/VSC8022

2.5Gb/s SONET-Compatible

8-Bit MUX/DEMUX Chipset

Page 16

G52028-0, Rev 4.1

05/25/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Package Information

NOTE: (1) At package body.

Item

mm (Min/Max)

in (Min/Max)

Item

mm (Min/Max)

in (Min/Max)

A

18.54/19. 56

0.730/0.770

I

0.41/0.61

0.016/0.024

B

1.02/1.52

0.040/0.060

J

2.03/2.79

0.080/0.110

15.49/16.51

0.610/0.650

0.09/0.24

0.003/0.009

15.24 TYP

0.600 TYP

L

4.57/5.34

0.180/0.210

E

1.27 TYP

0.050 TYP

M

27.69/30.22

1.090/1.190

F

0.76/1.02

0.030/0.040

N

0.36/0.56

0.014/0.022

G

16.94 TYP

0.667 TYP

O

1.75/1.90

0.069/0.075

H

1.91/2.41

0.075/0.095

——

—

52-Pin Leaded

Ceramic Package (LDCC)

HEAT SINK SIDE

PACKAGE IS

CAVITY DOWN

52

1

E

45°

N

O

K

C

A

I

J

M

L

B

NOTES:

Drawing not to scale.

Packages: Ceramic (alumina);

Heat sink: Copper-tungsten;

Leads: Alloy 42 with gold plating.

D